NIDEC COMPONENTS logo
NIDEC COMPONENTS logo

Liste

×

×


Produkte

Verteiler

EU-Deutsch

×

Pushbutton switch CFP2

●Um einen Kauf zu tätigen, wenden Sie sich an die Verteiler
oder nutzen Sie den stehenden Online-Shops unten.
Verkaufskanal  Überprüfen Sie die Verteiler.
VERKAUFSKANALKlicken Sie hier, um den Verteiler zu überprüfen.
Gehen Sie zum Farnell Online-Shop.
Gehen Sie zum RS Components Online-Shop.
Gehen Sie zum DigiKey Online-Shop.
Gehen Sie zum MOUSER Online-Shop.

Ultra-miniature pushbutton switch

  • Ultra-miniature pushbutton switch for high density mounting.
  • Washable.
  • Terminal pin pitch: 2.54 mm.
  • Independent detent mechanism ensures light operational feel.
  • Clip contact mechanism for long-term contact reliability.
  • Gold-plated contacts.
  • Terminal Pins: Straight 
  • Actuator Color: Gray

Specifications

Rating 0.4VA( 28VDC max.)
1μA 20mVDC
Initial contact resistance 100m Ω以下(AC200μV 1.5mA)
Dielectric strength 250VAC 1 minute
Insulation resistance 500MΩ min. ( 250VDC)
Electrical life 10,000 operations at max.rating
30,000 operations at min.rating
Mechanical life 30,000 cycles
Operating force 47±0.98 N
Operating temperature range -40~+85℃
Storage temperature range -40~+85℃

Part number designation

CFP2 -2RC4-AW

Series Actuator

P:Pushbutton

Number of poles

01: 1 bit    
02: 2 bits   

Switching function

1 pole:F /ON -(ON)

2 poles:R /ON -(ON)

Terminal style

C: P/C

C4: Right angle

C6: Vertical mounting

Actuator shape

A: Standard

Packaging

W: tray

List of part numbers

Part numberNumber of polesSwitching functionTerminal stylePackagingCAD
CFP2-1FC-AW 1 bit ON -(ON) P/C tray
CFP2-2RC-AW 2 bits ON -(ON) P/C tray
CFP2-1FC4-AW 1 bit ON -(ON) Right angle tray
CFP2-2RC4-AW 2 bits ON -(ON) Right angle tray
CFP2-1FC6-AW 1 bit ON -(ON) Vertical mounting tray
CFP2-2RC6-AW 2 bits ON -(ON) Vertical mounting tray

Handling Specifications

Soldering Specifications
  • Manual Soldering/Device:Soldering iron
    350℃ Max. 3 sec. Max.
  • Auto Soldering/Device:Jet wave type or dip type
    260℃ Max.3-5sec.(One time)Total dip time within 10sec.
  • Pre-heating should be done at temperatures from 80°C to 120°C and within 120 seconds
  • When soldering two or more terminals to a common land, use solder resist to separate them
Flux Cleaning
  • Solvents : Fluorine or Alcohol type
  • Cleaning after soldering should be done after the PC board is exposed to room temperature (30℃ or below) for 1 to 2 hours.
  • Do not use ultrasonic cleaning.

Environmental Data

●Die oben genannten Inhalte können ohne vorherige Ankündigung geändert werden.

Produkte

×

page top