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Toggle switch CFT2

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Ultra-Miniature Toggle Switch

 
FeaturesFeatures
  • Ultra-miniature toggle switch for high density mounting.

  • Washable.

  • Terminal pin pitch: 2.54 mm.

  • Independent detent mechanism ensures light operational feel.

  • Clip contact mechanism for long-term contact reliability.

  • Gold-plated contacts.

Specifications

Rating Max. 28VDC 0.4VA max.
Rating 1μ A 20mVDC
Initial contact resistance 100mΩ max.(1.5mA 200μVAC)
Dielectric strength 250VAC 1 minute
Insulation resistance 500MΩ min. (250VDC)
Electrical life 10,000 cycles at max. rating.
50,000 cycles at min. rating(D.E type)
30,000 cycles at min. rating(G.H type)
Mechanical life D.E type 50,000 cycles
G.H type 30,000 cycles
Operating temperature range -40℃~+85℃
Storage temperature range -40℃~+85℃

Part Numbering

CFT2 -2NC4 -AW

Series Actuator

Number of poles

01: 1 bit 
02: 2 bits
 

Switching function

D:ON-ON
E:ON-OFF-ON
G:(ON)-OFF-(ON)
H:ON-OFF-(ON)

Terminal style

C:PC Straight
C4:Right angle
C6:Vertical mounting

Actuator shape

A:Standard

Packaging spec

W:Tray

List of part numbers

Part NumberSwitching functionCircuitTerminal styleCAD
CFT2-1DC-AW ON-ON SPDT PC Straight
CFT2-1EC-AW ON-OFF-ON SPDT PC Straight
☆CFT2-1GC-AW (ON)-OFF-(ON) SPDT PC Straight
☆CFT2-1HC-AW ON-OFF-(ON) SPDT PC Straight
CFT2-1DC4-AW ON-ON SPDT Right angle
CFT2-1EC4-AW ON-OFF-ON SPDT Right angle
☆CFT2-1GC4-AW (ON)-OFF-(ON) SPDT Right angle
☆CFT2-1HC4-AW ON-OFF-(ON) SPDT Right angle
CFT2-1DC6-AW ON-ON SPDT Vertical mounting
CFT2-1EC6-AW ON-OFF-ON SPDT Vertical mounting
☆CFT2-1GC6-AW (ON)-OFF-(ON) SPDT Vertical mounting
☆CFT2-1HC6-AW ON-OFF-(ON) SPDT Vertical mounting
☆:Semi-standard products. (ON):Momentary.

Soldering Specifications

  • Manual Soldering
    Device:Soldering iron
    350℃, Max.; 3 seconds, Max.
  • Auto Soldering
    Device:Jet wave type or dip type
    260℃, Max.; 3 to 5 seconds (One time)
    Total dip time within 10 sec.
    ※Pre-heating should be done at temperatures ranging from 80℃ to 120℃ and within 120 sec.

  • When soldering two or more terminals to the common land, use the solder resist to solder them independently.

Flux Cleaning

  • Solvent : Fluorine or Alcohol type.
  • Cleaning after soldering should be done after the PC board is exposed to room temperature (30℃ or below) for 1 to 2 hours.
  • Do not use ultrasonic cleaning.

Environmental Data

●Die oben genannten Inhalte können ohne vorherige Ankündigung geändert werden.

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