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Tactile switch SMT3/SMTE3

●To make a purchase, contact Distributors, or use e-commerce below.
SALES CHANNEL  ;Check our Distributors.
SALES CHANNELClick here to check our Distributors.
To the Tactile switch “SMT3/SMTE3 series” page on the DigiKey online shop
To the Tactile switch “SMT3/SMTE3 series” page on the Mouser online shop

Surface Mount Tactile Switches

  • Compatible With Lead-Free, Reflow Soldering
    Heat-resistance resin for lead-free soldering.
  • Washable (SMTE3 Series)
  • J-Lead Terminal Pins For High-Density Mounting
  • Anti-Static Electricity (SMTE3 Series)
    Ground terminal is provided to prevent damage to element caused by static electricity.
◆Structure

Specifications

Rating Max. 0.6VA max. (24VDC max. 30mA max.)
Rating Min. Silver plated contacts 1mA 5VDC(Resistive load)
Gold plated contacts 10μA 5VDC(Resistive load)
Initial contact resistance 100mΩ max.(1.5mA 200μVAC)
Dielectric strength A250VAC 1 minute
Insulation resistance 100MΩ min. (100VDC)
Electrostatic capacity 5pF max.
Electrical life 100,000 operations
Stroke SMT3:0.25mm 
SMTE3:0.5mm
Operating force SMT3:1.18±0.39 N 
SMTE3:1.96±0.98 N
Operating temperature range -25~+70℃
Storage temperature range -40~+85℃

Part number designation

SMTEG3 -01E-Z

Series code

None:Standard type (Plastic button)

Immersion washable (Rubber button)

Structure

Contact plating

None:Silver plated
 G: Gold plated

Series No.

Registration No.

Packaging specs.

None: Stick
 E: E Emboss taping

List of part numbers

Part NumberStructurePackagingCAD
SMT3-01-Z Standard type(Plastic button) Stick
SMTE3-01-Z Immersion washablee(Rubber button) Stick
★SMTEG3-01-Z Immersion washablee(Rubber button) Stick
SMT3-01E-Z Standard type(Plastic button) Emboss taping
★SMTG3-01E-Z Standard type(Plastic button) Emboss taping
SMTE3-01E-Z Immersion washablee(Rubber button) Emboss taping
★SMTEG3-01E-Z Immersion washablee(Rubber button) Emboss taping

Pad Layouts

Soldering Specifications

  • Manual Soldering
    Device : Soldering iron
    ①350°C ± 10°C; 3 ± 0.5 seconds
  • Reflow Soldering
    Device : Inline or batch system

・Apply reflow soldering up to 2 times max.

Flux Cleaning

※Since the SMT3 series is not process sealed, be sure to use low-residue flux.

  • Solvent: Fluorine or Alcohol type Cleaning with other solvents or water is not possible.
  • Cleaning after soldering should be done after the terminal temperature falls to 90°C or below, or after leaving the switch for five minutes or longer at room temperature. Cleaning temperature: 43°C, max.
  • Do not use ultrasonic cleaning.

Environmental Data

●The above contents and descriptions are subject to change without notice. 

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