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Pushbutton switch FP

●To buy this product, please go to the following Online Web stores.
To the Pushbutton switch “FP series” page on the RS online shop
To the Pushbutton switch “FP series” page on the Chip One Stop online shop
To the Pushbutton switch “FP series” page on the Mouser online shop

Ultra-Miniature Pushbutton Switches

  1. Ultra-miniature pushbutton switch for high density mounting.
  2. Washable.
  3. Terminal pin pitch: 2.54 mm.
  4. Independent detent mechanism ensures light operational feel.
  5. Clip contact mechanism for long-term contact reliability.
  6. Gold-plated contacts.

Specification

Rating Max.:0.4VA(28VDC max.)
Min.:1μA 20mVDC
Initial contact resistance 100mΩmax.(1.5mA 200μVAC)
Dielecteic strength 250V AC 1 minute
Insulation resistance 500MΩ min.(250VDC)
Electrical life 10,000 operations at max.rating,
30,000 operations at min.rating,
Mechanical life 30,000 cycles
Operating force 1.47±0.98N
Operating temperature range -40~+85℃
Setmorpaegrea ture range -40~+85℃

Part number designation

FP2F -2MZ

Series code

Actuator shape

P:Pushbutton

Number of poles

1: 1 pole
2: 2 poles

Switching function

F: ON -( ON)

Terminal style

2: P/C
5: Right angle

4: Vertical mounting

Actuator shape

M: Standard

 

List of part numbers

Part numberNumber of polesSwitching functionSwitching functionCAD
FP1F-2M-Z 1 pole ON -( ON) P/C
FP2F-2M-Z 2 poles ON -( ON) P/C
FP1F-5M-Z 1 pole ON -( ON) Right angle
FP2F-5M-Z 2 poles ON -( ON) Right angle
FP1F-4M-Z 1 pole ON -( ON) Vertical mounting
FP2F-4M-Z 2 poles ON -( ON) Vertical mounting

Soldering Specifications

  • Manual Soldering
    Device:Soldering iron
    380°C, Max.; 3 seconds, Max.
  • Auto soldering
    Device:Jet wave type or dip type
    275°C, Max.; 6 seconds, Max.
    ・Pre-heating should be done at temperatures from 80 to 120°C and within 120 seconds.
  • When soldering two or more terminals to the common land, use solder resist to solder them independently.

Flux Cleaning

  • Solvents :Fluorine or Alcohol type
  • Cleaning after soldering should be done after the PC board is exposed to room temperature (30℃ or below) for 1 to 2 hours.
  • Do not use ultrasonic cleaning.

Environmental Data

●The above contents and descriptions are subject to change without notice. 

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